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MP44019GS Datasheet(PDF) 5 Page - Monolithic Power Systems

No. de pieza MP44019GS
Descripción Electrónicos  CrM/DCM Multi-Mode PFC Controller with Second OVP
PDF  29 Pages
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Fabricante Electrónico  MPS [Monolithic Power Systems]
Página de inicio  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP44019GS Datasheet(HTML) 5 Page - Monolithic Power Systems

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MP44019
– CRM/DCM MULTI-MODE PFC CONTROLLER WITH SECOND OVP
MP44019 Rev. 1.0
MonolithicPower.com
5
4/30/2021
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2021 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage (VCC) .................... -0.3V to +35V
FB, COMP, MAINSIN, CS...............-0.3V to +6V
GATE ............................................-0.3V to +14V
ZCD ................................................-0.5V to +8V
ZCD current .............................-10mA to +10mA
Continuous power dissipation (TA = 25°C) (2)
SOIC-8 ....................................................... 1.4W
Junction temperature
……………………… 150°C
Lead temperature (solder) ........................260°C
Storage temperature ................ -55°C to +150°C
ESD Ratings
Human body model (HBM) ........................ ±2kV
Charged device model (CDM).................... ±2kV
Recommended Operating Conditions (3)
Supply voltage (VCC)………………… 12V to 32V
MAINSIN
………………………………… 0V to 4V
Maximum junction temp (TJ) .....................125°C
Thermal Resistance (4)
θJA
θJC
SOIC-8
……………...................90...... 45... °C/W
Notes:
1)
Exceeding these ratings may damage the device.
2)
The maximum allowable power dissipation is a function of the
maximum junction temperature, TJ (MAX), the junction-to-
ambient
thermal
resistance,
θ
JA,
and
the
ambient
temperature, TA. The maximum allowable continuous power
dissipation at any ambient temperature is calculated by D
(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum
allowable
power
dissipation
will
cause
excessive
die
temperature, and the regulator will go into thermal shutdown.
Internal thermal shutdown circuitry protects the device from
permanent damage.
3)
The device is not guaranteed to function outside of its
operating conditions.
4)
Measured on JESD51-7, 4-layer PCB.



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