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ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

ADS5510

SLAS499 – JANUARY 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

ORDERING INFORMATION(1)

SPECIFIED

PACKAGE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

TEMPERATURE

DESIGNATOR

MARKING

NUMBER

MEDIA, QUANTITY

RANGE

ADS5510IPAP

Tray, 160

HTQFP-64(2)

ADS5510

PAP

–40

°C to 85°C

ADS5510I

PowerPAD

ADS5510IPAPR

Tape and Reel, 1000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

Thermal pad size: 3,5 mm x 3,5 mm (min), 4 mm x 4 mm (max).

θ

JA = 21.47°C/W and θJC = 2.99°C/W, when used with 2 oz. copper

trace and pad soldered directly to a JEDEC standard, four-layer, 3 in x 3 in PCB.

over operating free-air temperature range (unless otherwise noted)(1)

UNIT

AVDD to AGND, DRVDD to DRGND

–0.3 to 3.7

V

VSS

Supply Voltage

AGND to DRGND

±0.1

V

Analog input to AGND(2)(3)

–0.3 to minimum (AVDD + 0.3, 3.6)

V

Logic input to DRGND

–0.3 to DRVDD

V

Digital data output to DRGND

–0.3 to DRVDD

V

Operating temperature range

–40 to 85

°C

TJ

Junction temperature

105

°C

Tstg

Storage temperature range

–65 to 150

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

If the input signal can exceed 3.6 V, then a resistor greater than or equal to 25

Ω should be added in series with each of the analog

input pins to support input voltages up to 3.8 V. For input voltages above 3.8 V, the device can only handle transients and the duty cycle

of the overshoot should be limited to less than 5% for inputs up to 3.9 V.

(3)

The overshoot duty cycle can be defined as the ratio of the total time of overshoot to the total intended device lifetime, expressed as a

percentage. The total time of overshoot is the integrated time of all overshoot occurrences over the lifetime of the device.

PARAMETER

MIN

TYP

MAX

UNIT

Supplies

AVDD

Analog supply voltage

3

3.3

3.6

V

DRVDD

Output driver supply voltage

3

3.3

3.6

V

Analog input

Differential input range

2.3

VPP

VCM

Input common-mode voltage(1)

1.45

1.55

1.65

V

Digital Output

Maximum output load

10

pF

Clock Input

DLL ON

60

125

ADCLK input sample rate (sine wave) 1/tC

MSPS

DLL OFF

2

80

Clock amplitude, sine wave, differential

1

3

VPP

Clock duty cycle

50%

TA

Open free-air temperature range

–40

85

°C

(1)

Input common-mode should be connected to CM.

2

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