Data Sheet

ADRF5448

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 14

Table 2. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage

Positive

−0.3 V to +3.6 V

Negative

−3.6 V to +0.3 V

Digital Control Input Voltage

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power1 (VDD = 3.3 V, VSS = −3.3 V,

f = 250 MHz to 40 GHz, TCASE = 85°C2)

Through Path

29.5 dBm

Terminated Path

18 dBm

Hot Switching

29.5 dBm

RF Power Under Unbiased Condition (VDD, VSS = 0 V) 10 dBm

Temperature

Junction (TJ)

135°C

Storage

−65°C to +150°C

Reflow

260°C

1 For power derating over frequency, see Figure 2 and Figure 3.

2 For 105°C operation, the power handling degrades from the TCASE = 85°C

specifications by 3 dB.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Only one absolute maximum rating can be applied at any one time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to package bottom)

thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC1

Unit

C-33-1

Through Path

110

°C/W

Terminated Path

900

°C/W

1 θJC is determined by simulation under the following conditions: the heat

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TDIE = 85°C

Figure 3. Power Derating vs. Frequency, High Frequency Detail, TDIE = 85°C