AS1163B

Absolute maximum ratings

Short Datasheet

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Absolute maximum ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent

damage to the device. These are stress ratings only. Functional operation of the device at

these or any other conditions beyond those indicated under “Operating Conditions” is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 3: Absolute maximum ratings of AS1163B

Symbol

Parameter

Min

Max

Unit

Comments

Electrical parameters

VDD / VGND

Supply voltage to ground

-0.3

7

V

Referenced to GND

VIN

Input pin voltage to

ground

-0.3

VDD+0.3

V

ISCR

Input current (latch-up

immunity)

± 100

mA

AEC-Q100-004

Continuous power dissipation (TA = 70 °C)

PT

Continuous power

dissipation

600

mW

Continuous power dissipation (TA = 125 °C, VOUT = 2.5 V, RTH = 71.6 °C/W)

PT

Continuous power

dissipation

300

mW

Electrostatic discharge

ESDHBM

Electrostatic discharge

HBM

± 4

KV

AEC-Q100-002

ESDCDM

Electrostatic discharge

CDM

± 500

V

AEC-Q100-011, ±750V for corner pins

Temperature ranges and storage conditions

TA

Operating ambient

temperature

-40

125

°C

TJ

Operating junction

temperature

-40

150

°C

TSTRG

Storage temperature

range

-55

150

°C

TBODY

Package body

temperature

260

°C

IPC/JEDEC J-STD-020 (1)

RHNC

Relative humidity (non-

condensing)

5

85

%

MSL

Moisture sensitivity level

3

ICP/JEDEC J-STD-033

(1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-

020 “Moisture/Reflow

Sensitivity Classification for Non-

hermetic Solid State Surface Mount Devices.” The lead finish for Pb‑free leaded packages is

“Matte Tin” (100 % Sn).