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MPC8313ECVRAFDB Datasheet(PDF) 24 Page - Freescale Semiconductor, Inc |
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MPC8313ECVRAFDB Datasheet(HTML) 24 Page - Freescale Semiconductor, Inc |
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24 / 100 page ![]() MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2.1 24 Freescale Semiconductor Ethernet: Three-Speed Ethernet, MII Management Figure 9 provides the AC test load for TSEC. Figure 9. TSEC AC Test Load Figure 10 shows the MII receive AC timing diagram. Figure 10. MII Receive AC Timing Diagram RMII AC Timing Specifications RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns RX_CLK clock rise VIL(min) to VIH(max) tMRXR 1.0 — 4.0 ns RX_CLK clock fall time VIH(max) to VIL(min) tMRXF 1.0 — 4.0 ns Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Table 27. MII Receive AC Timing Specifications (continued) At recommended operating conditions with LVDDA/LVDDB/NVDD of 3.3 V ± 0.3 V. Parameter/Condition Symbol1 Min Typ Max Unit Output Z0 = 50 Ω LVDDA/2 or LVDDB/2 RL = 50 Ω RX_CLK RXD[3:0] tMRDXKH tMRX tMRXH tMRXR tMRXF RX_DV RX_ER tMRDVKH Valid Data |
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