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MPC8533ECHXARJB Datasheet(PDF) 79 Page - Freescale Semiconductor, Inc

No. de pieza MPC8533ECHXARJB
Descripción Electrónicos  PowerQUICC??III Integrated Processor Hardware Specifications
PDF  116 Pages
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Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8533ECHXARJB Datasheet(HTML) 79 Page - Freescale Semiconductor, Inc

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MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
79
Package Description
18.2
Mechanical Dimensions of the MPC8533E FC-PBGA
Figure 55 shows the mechanical dimensions and bottom surface nomenclature of the MPC8533E,
783 FC-PBGA package without a lid.
Figure 55. Mechanical Dimensions and Bottom Surface Nomenclature
of the MPC8533E FC-PBGA without a Lid
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
6. Capacitors may not be present on all parts. Care must be taken not to short exposed metal capacitor pads.
7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise.



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