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MPC8533ECHXARJB Datasheet(PDF) 95 Page - Freescale Semiconductor, Inc

No. de pieza MPC8533ECHXARJB
Descripción Electrónicos  PowerQUICC??III Integrated Processor Hardware Specifications
PDF  116 Pages
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Fabricante Electrónico  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
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MPC8533ECHXARJB Datasheet(HTML) 95 Page - Freescale Semiconductor, Inc

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MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3
Freescale Semiconductor
95
Thermal
Figure 56. System Level Thermal Model for MPC8533E (Not to Scale)
The Flotherm library files of the parts have a dense grid to accurately capture the laminar boundary layer
for flow over the part in standard JEDEC environments, as well as the heat spreading in the board under
the package. In a real system, however, the part will require a heat sink to be mounted on it. In this case,
the predominant heat flow path will be from the die to the heat sink. Grid density lower than currently in
the package library file will suffice for these simulations. The user will need to determine the optimal grid
for their specific case.
Solder and Air (29
× 29 × 0.58 mm)
Kx
0.034
W/m•K
Ky
0.034
Kz
12.1
Table 67. MPC8533EThermal Model (continued)
Conductivity
Value
Units
Bump Underfill
Section A-A
A
A
Top View
Die
Substrate
Solder/Air



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