MPC8533ECHXAAJB datasheet(97/116 Pages) FREESCALE

97 / 116 page

MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

Thermal

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Millennium Electronics (MEI)

408-436-8770

Loroco Sites

671 East Brokaw Road

San Jose, CA 95112

Internet: www.mei-thermal.com

Tyco Electronics

800-522-6752

Chip Coolers™

P.O. Box 3668

Harrisburg, PA 17105-3668

Internet: www.chipcoolers.com

Wakefield Engineering

603-635-2800

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal

performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several

heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha Novatech, IERC, Chip

Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient thermal

resistances, that will allow the MPC8533E to function in various environments.

20.3.1

Internal Package Conduction Resistance

For the packaging technology, shown in Table 65, the intrinsic internal conduction thermal resistance paths

are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

MPC8533ECHXAAJB Datasheet(PDF) 97 Page - Freescale Semiconductor, Inc