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MPC5123 Datasheet(PDF) 23 Page - Freescale Semiconductor, Inc |
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MPC5123 Datasheet(HTML) 23 Page - Freescale Semiconductor, Inc |
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23 / 86 page ![]() Electrical and Thermal Characteristics MPC5121E/MPC5123 Data Sheet, Rev. 4 Freescale Semiconductor 23 3.1.4 Electrostatic Discharge CAUTION This device contains circuitry that protects against damage due to high-static voltage or electrical fields. However, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages. Operational reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (GND or VDD). Table 10 gives package thermal characteristics for this device. 3.1.5 Power Dissipation Power dissipation of the MPC5121e/MPC5123 is caused by 4 different components: the dissipation of the internal or core digital logic (supplied by VDD_CORE), the dissipation of the analog circuitry (supplied by SYS_PLL_AVDD and CORE_PLL_AVDD), the dissipation of the IO logic (supplied by VDD_MEM_IO and VDD_IO) and the dissipation of the PHYs (supplied by own supplies). Table 9 details typical measured core and analog power dissipation figures for a range of operating modes. However, the dissipation due to the switching of the IO pins can not be given in general, but must be calculated for each application case using the following formula: Eqn. 1 where N is the number of output pins switching in a group M, C is the capacitance per pin, VDD_IO is the IO voltage swing, f is the switching frequency and PIOint is the power consumed by the unloaded IO stage. The total power consumption of the device must not exceed the value that would cause the maximum junction temperature to be exceeded. Eqn. 2 Table 8. ESD and Latch-Up Protection Characteristics Sym Rating Min Max Unit SpecID VHBM Human Body Model (HBM) – JEDEC JESD22-A114-B 2000 — V D4.1 VMM Machine Model (MM) – JEDEC JESD22-A115 200 — V D4.2 VCDM Charge Device Model (CDM) – JEDEC JESD22-C101 500 — V D4.3 Table 9. Power Dissipation Core Power Supply (VDD_CORE) SpecID Mode High-Performance Unit e300 = 300 MHz, CSB = 200 MHz Operational1 800 mW D5.1 Deep-Sleep1 1mW D5.2 Hibernation 20 uW D5.3 PLL/OSC Power Supplies (SYS_PLL_AVDD, CORE_PLL_AVDD) Typical 25 mW D5.4 Unloaded I/O Power Supplies (VDD_IO, VDD_MEM_IO) P IO P IOint N M ∑ + CVDD_IO 2 f × × × = P total P core P analog P IO PPHYs ++ + = |
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