MPC8308 datasheet(79/88 Pages) FREESCALE

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MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 0

Freescale Semiconductor

Thermal

22 Thermal

This section describes the thermal specifications of the device.

22.1

Thermal Characteristics

Table 59 provides the package thermal characteristics for the 473, 19

× 19 mm MAPBGA.

0010

2.5:1

0011

03:1

0011

03:1

0011

03:1

Note:

1 For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 333 MHz.

2 Core VCO frequency = core frequency

× VCO divider. Note that VCO divider has to be set properly so that the

core VCO frequency is in the range of 400–800 MHz.

Table 59. Package Thermal Characteristics for MAPBGA

Characteristic

Board Type

Symbol

Value

Unit

Notes

Junction to Ambient Natural Convection

Single layer board (1s)

RθJA

°C/W

1,2

Junction to Ambient Natural Convection

Four layer board (2s2p)

RθJA

°C/W

1,2,3

Junction to Ambient (@200 ft/min)

Single layer board (1s)

RθJMA

°C/W

1,3

Junction to Ambient (@200 ft/min)

Four layer board (2s2p)

RθJMA

°C/W

1,3

Junction to Board

—

RθJB

°C/W

Junction to Case

—

RθJC

9°C/W

Junction to Package Top

Natural Convection

2°C/W

Table 58. e300 Core PLL Configuration (continued)

RCWL[COREPLL]

core_clk: csb_clk Ratio1

VCO Divider (VCOD)2

0–1

2–5

MPC8308 Datasheet(PDF) 79 Page - Freescale Semiconductor, Inc

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