AD5560JBCZ datasheet(64/68 Pages) AD

64 / 68 page

AD5560

Data Sheet

Rev. D | Page 64 of 68

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-026-ACD-HU

0.50

BSC

LEAD PITCH

12.20

12.00 SQ

11.80

10.20

10.00 SQ

9.80

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

7°

3.5°

0°

0.15

0.05

0.08

COPLANARITY

VIEW A

ROTATED 90° CCW

1.05

1.00

0.95

0.20

0.09

VIEW A

1.20

MAX

SEATING

PLANE

0.75

0.60

0.45

1.00 REF

0.27

0.22

0.17

BOTTOM VIEW

(PINS UP)

0.675

0.872

7.85

BSC

7.85

BSC

5.95

BSC

5.95 BSC

TOP VIEW

(PINS DOWN)

EXPOSED

PAD

Figure 63. 64-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]

(SV-64-3)

Dimensions shown in millimeters

*COMPLIANT TO JEDEC STANDARDS MO-225 WITH

EXCEPTION TO PACKAGE HEIGHT.

BOTTOM VIEW

DETAIL A

TOP VIEW

DETAIL A

6.865 REF

5.720 REF

0.40 REF

(DIE OFFSET)

8.10

8.00 SQ

7.90

*1.20

1.08

1.00

0.36

REF

SEATING

PLANE

0.39

0.34

0.29

0.81

0.76

0.71

0.50

0.45

0.40

BALL DIAMETER

COPLANARITY

0.12

6.40

BSC SQ

0.80

BSC

0.80

REF

A1 BALL

CORNER

A1 BALL

CORNER

Figure 64. 72-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-72-2)

Dimensions shown in millimeters

AD5560JBCZ Datasheet(PDF) 64 Page - Analog Devices

AD5560JBCZ Datasheet(HTML) 64 Page - Analog Devices

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