STM8T143 datasheet(52/65 Pages) STMICROELECTRONICS

52 / 65 page

Package characteristics

STM8T143

52/65

DocID18315 Rev 6

10.2

Package thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 10: Operating characteristics on page 38.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

•

TAmax is the maximum ambient temperature in °C

•ΘJA is the package junction-to-ambient thermal resistance in ° C/W

•

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

•

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

•

PI/Omax represents the maximum power dissipation on output pins

Where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in the

application.

Note:

Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural

convection environment.

10.2.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

Table 27. Thermal characteristics

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

SO8 (narrow)

130

°C/W

ΘJA

Thermal resistance junction-ambient

UFDFPN 8 (2 x 3 mm)

120

°C/W

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