GCM Series Specification and Test Methods

Continued from the preceding page.

Type

a

0.3

0.5

0.6

0.8

2.0

2.0

b

0.9

1.5

2.2

3.0

4.4

4.4

c

0.3

0.6

0.9

1.3

1.7

2.6

(in mm)

GCM03

GCM15

GCM18

GCM21

GCM31

GCM32

Type

a

0.3

0.4

1.0

1.2

2.2

2.2

b

0.9

1.5

3.0

4.0

5.0

5.0

c

0.3

0.5

1.2

1.65

2.0

2.9

(in mm)

GCM03

GCM15

GCM18

GCM21

GCM31

GCM32

b

C

100

a

t: 1.6mm

(GCM03/15: 0.8mm)

45

45

R4

20

114

Pressunzing

speed: 1.0mm/sec

Pressurize

Capacitance meter

Flexure:

V2

(High Dielectric Type)

Flexure:

V3

(Temperature

Compensating Type)

c

Baked electrode or

copper foil

Solder resist

(t=1.6mm

GCM03/15: 0.8mm)

Iron Board

0.6

L

Place the capacitor in the beam load fixture as Fig. 4.

Apply a force.

< Chip Length: 2.5mm max. >

Speed supplied the Stress Load: 0.5mm / sec.

< Chip Length: 3.2mm min. >

Speed supplied the Stress Load: 2.5mm / sec.

Fig. 4

20

Beam Load Test

The chip endure following force.

< Chip L dimension: 2.5mm max. >

Chip thickness

G 0.5mm rank: 20N

Chip thickness

V 0.5mm rank: 8N

< Chip L dimension: 3.2mm min. >

Chip thickness

F 1.25mm rank: 15N

Chip thickness

U 1.25mm rank: 54.5N

Solder the capacitor to the test jig (glass epoxy board) shown in

Fig. 3 using a eutectic solder. Then apply *18N force in parallel

with the test jig for 60sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

*2N (GCM03/15)

Fig. 3

19

Terminal

Strength

Appearance

No marking defects

Capacitance

Change

Within the specified tolerance

Q/D.F.

30pF min.: Q

U1000

30pF max.: Q

U400+20C

C: Nominal Capacitance (pF)

*1

W.V.: 25Vmin.: 0.025 max.

W.V.: 16V: 0.035 max.

I.R.

More than 10,000M

Ω or 500Ω · F

(Whichever is smaller)

*1

Solder the capacitor on the test jig (glass epoxy board) shown in

Fig. 1 using a eutectic solder. Then apply a force in the direction

shown in Fig. 2 for 5

±1sec. The soldering should be done by the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

Fig. 2

18

Board

Flex

Appearance

No marking defects

Capacitance

Change

Within

±5.0% or ±0.5pF

(Whichever is larger)

Within

±10.0%

Q/D.F.

30pF min.: Q

U1000

30pF max.: Q

U400+20C

C: Nominal Capacitance (pF)

*1

W.V.: 25Vmin.: 0.025 max.

W.V.: 16V: 0.035 max.

I.R.

More than 10,000M

Ω or 500Ω · F

(Whichever is smaller)

*1

Fig. 1

No.

AEC-Q200 Test Method

Specifications

Temperature Compensating Type

High Dielectric Type

AEC-Q200

Test Item

Continued on the following page.

*1: The figure indicates typical specification. Please refer to individual specifications.

Specifications and Test Methods

17

1

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

!Note

C03E.pdf

10.5.20