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AX2000 Datasheet(PDF) 54 Page - Microsemi Corporation

No. de pieza AX2000
Descripción Electrónicos  Axcelerator Family FPGAs
PDF  262 Pages
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Fabricante Electrónico  MICROSEMI [Microsemi Corporation]
Página de inicio  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

AX2000 Datasheet(HTML) 54 Page - Microsemi Corporation

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Detailed Specifications
2- 40
R e v i sio n 1 8
3.3 V PCI, 3.3 V PCI-X
Peripheral Component Interface for 3.3 V standard specifies support for both 33 MHz and 66 MHz PCI
bus applications. It uses an LVTTL input buffer and a push-pull output buffer. The input and output buffers
are 5 V tolerant with the aid of external components. Axcelerator 3.3 V PCI and 3.3 V PCI-X buffers are
compliant with the PCI Local Bus Specification Rev. 2.1.
The PCI Compliance Specification requires the clamp diodes to be able to withstand for 11 ns, –3.5 V in
undershoot, and 7.1 V in overshoot.
AC Loadings
Table 2-33 • DC Input and Output Levels
VIL
VIH
VOL
VOH
IOL
IOH
Min., V
Max., V
Min., V
Max., V
Max., V
Min., V
mA
mA
PCI
–0.3
0.3 VCCI
0.5 VCCI
VCCI + 0.5
(per PCI specification)
PCI-X
–0.5
0.35 VCCI
0.5 VCCI
VCCI + 0.5
(per PCI specification)
Figure 2-18 • AC Test Loads
Table 2-34 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V)
Input High (V)
Measuring Point* (V)
VREF (typ) (V)
Cload (pF)
(Per PCI Spec and PCI-X Spec)
N/A
10
Note:
* Measuring Point = VTRIP
R to VCCI for tpl
R to GND for tph
10 pF
GND
Test point for data
R = 25
35 pF for tpzl / tpzh
5 pF for tphz / tplz
R to VCCI for tplz / tpzl
R to GND for tphz / tpzh
Test Point
for tristate
R = 1k



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