AX2000 datasheet(2/262 Pages) MICROSEMI

2 / 262 page

Axcelerator Family FPGAs

R evis i o n 18

Ordering Information

Device Resources

User I/Os (Including Clock Buffers)

Package

AX125

AX250

AX500

AX1000

AX2000

PQ208

–

115

–

CQ208

–

115

–

CQ256

–

136

FG256

138

–

FG324

168

––

CQ352

–

198

FG484

–

248

317

–

CG624

–

418

FG676

–

336

418

–

BG729

–––

516

–

FG896

–

516

586

FG1152

–––

–

684

Note:

The FG256, FG324, and FG484 are footprint compatible with one another. The FG676, FG896, and FG1152 are also footprint

compatible with one another.

Lead-Free Packaging

Blank = Standard Packaging

G= RoHS-Compliant Packaging

AX1000

Blank = Standard Speed

= Approximately 15% Faster than Standard

= Approximately 25% Faster than Standard

Package Type

= Ball Grid Array (1.27mm pitch)

= Fine Ball Grid Array (1.0mm pitch)

PQ = Plastic Quad Flat Pack (0.5mm pitch)

CQ= Ceramic Quad Flat Pack (0.5mm pitch)

896

Package Lead Count

Application

Blank = Commercial (0 to +70° C)

I = Industrial (-40 to +85° C)

PP = Pre-Production

125,000 Equivalent System Gates

AX125 =

AX250

250,000 Equivalent System Gates

AX500

500,000 Equivalent System Gates

AX1000

1,000,000 Equivalent System Gates

AX2000

2,000,000 Equivalent System Gates

Part Number

Speed Grade

CG= Ceramic Column Grid Array

M = Military (-55 to +125° C)

AX2000 Datasheet(PDF) 2 Page - Microsemi Corporation

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