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MCP8024 Datasheet(PDF) 39 Page - Microchip Technology |
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MCP8024 Datasheet(HTML) 39 Page - Microchip Technology |
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39 / 46 page ![]() 2013 Microchip Technology Inc. DS20005228A-page 39 MCP8024 RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C2 Y2 X1 C1 X2 E Y1 Dimension Limits Units C1 Optional Center Tab Width Contact Pad Spacing Contact Pad Spacing Optional Center Tab Length Contact Pitch C2 Y2 X2 3.50 3.50 MILLIMETERS 0.50 BSC MIN E MAX 8.40 8.40 Contact Pad Length (X48) Contact Pad Width (X48) Y1 X1 1.50 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing No. C04-2183A NOM 48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Thermal Tab |
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