RN4870 datasheet(21/48 Pages) MICROCHIP

No. de pieza	RN4870

Descripción Electrónicos	Bluetooth 4.2 Low Energy Module

PDF	48 Pages

Scroll/Zoom	100%

Fabricante Electrónico	MICROCHIP [Microchip Technology]

Página de inicio	http://www.microchip.com

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21 / 48 page

 2016 Microchip Technology Inc.

DS50002489A-page 21

RN4870/71

FIGURE 4-13:

RECOMMENDATIONS FOR THE PLACEMENT OF THE MODULE ON THE HOST

PCB BOARD

4.5

Soldering Recommendations

The RN4870/71 Bluetooth modules are assembled

using standard lead-free reflow profile IPC/JEDEC

J-STD-020.

The module can be soldered to the host PCB using

standard leaded and lead-free solder reflow profiles.

To avoid damaging the module, the following recom-

mendations are given:

• Microchip Technology Application Note, “AN233

Solder Reflow Recommendation” (DS00233)

provides solder reflow recommendations

•Do not exceed peak temperature (TP) of 250°C

• Refer to the solder paste data sheet for specific

reflow profile recommendations

• Use no-clean flux solder paste

•Do not wash as moisture can be trapped under

the shield

• Use only one flow. If the PCB requires multiple

flows, apply the module on the final flow.

Acceptable

Best

Acceptable

Lowest

performance

RN4870 Datasheet(PDF) 21 Page - Microchip Technology