RN4870 datasheet(13/48 Pages) MICROCHIP

No. de pieza	RN4870

Descripción Electrónicos	Bluetooth 4.2 Low Energy Module

PDF	48 Pages

Scroll/Zoom	100%

Fabricante Electrónico	MICROCHIP [Microchip Technology]

Página de inicio	http://www.microchip.com

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13 / 48 page

 2016 Microchip Technology Inc.

DS50002489A-page 13

RN4870/71

4.0

PHYSICAL DIMENSIONS AND

ATTRIBUTES

4.1

RN4870 Module

Figure 4-1 shows the physical dimensions of the

RN4870 module. Figure 4-2 illustrates the recom-

mended PCB layout, and Figure 4-3 shows the recom-

mended mounting details.

Ensure that there is no top copper layer near the test

pin area, indicated by the shaded keep out areas, as

shown in Figure 4-2. When laying out the host PCB, the

areas under the antenna must not contain any top,

inner layer, or bottom copper as shown in Figure 4-3. A

low-impedance ground plane ensures the best radio

performance (best range; lowest noise). Figure 4-3

also shows a minimum ground plane area to the left

and right side of the module for best antenna

performance. The ground plane can be extended

beyond the minimum recommended as required for

host PCB EMC noise reduction. For best range

performance, keep all external metal at least 30 mm

away from the ceramic chip antenna.

FIGURE 4-1:

RN4870 MODULE DIMENSIONS

RN4870 Datasheet(PDF) 13 Page - Microchip Technology