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LM363 Datasheet(PDF) 13 Page - National Semiconductor (TI) |
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LM363 Datasheet(HTML) 13 Page - National Semiconductor (TI) |
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13 / 22 page ![]() Application Hints (Continued) Because the LM363’s output voltage is approximately one diode drop below the voltage at pin 15 (pin 8 for the 8-pin device) this point may be used to limit output swing as seen in Figure 7a Current available from this pin is only 50 mA so that zeners must have a sharp breakdown to clamp accu- rately Alternatively a diode tied to a voltage source could be used as in Figure 7b TLH5609 – 15 FIGURE 7 Output Clamp SHIELD DRIVERS When differential signals are sent through long cables three problems occur First noise both common-mode and differ- ential is picked up Second signal bandwidth is reduced by the RC low-pass filter formed by the source impedance and the cable capacitance Finally when these RC time con- stants are not identical (unbalanced source impedance andor unbalanced capacitance) AC common-mode rejec- tion is degraded amplifying both induced noise and ‘‘ground’’ noise Either filtering at the amplifier inputs or slowing down the amplifier by overcompensating will indeed reduce the noise but the price is slower response The LM363D’s dual shield drivers can actually increase band- width while reducing noise The way this is done is by bootstrapping out shield capaci- tance The shield drivers follow the input signal Since both sides of the shield capacitance swing the same amount it is effectively out of the circuit at frequencies of interest Hence the input signal is not rolled off and AC CMRR is not degraded ( Figure 8 ) The LM363D’s shield drivers can han- dle capacitances (shield to center conductor) as high as 1000 pF with source resistances up to 100 kX For best results identical shielded cables should be used for both signal inputs although small mismatches in shield driver to ground capacitance (s500 pF) do not cause prob- lems At certain low values of cable capacitance (50 pF – 200 pF) high frequency oscillations can occur at high source resistance (t 10 kX) This is alleviated by adding 50 pF to ground at both shield driver outputs Do not use only one shield driver for a single-ended signal as oscilla- tions can result shield driver to input capacitance must be roughly balanced (g30%) To further reduce noise pickup the shielded signal lines may be enclosed together in a grounded shield If a large amount of RF noise is the prob- lem the only sure cure is a filter capacitor at both inputs otherwise the RFI may be internally rectified producing an offset DC loading on the shield drivers should be minimized The drivers can only source approximately 40 mA above this value the input stage bias voltages change degrading VOS and CMRR While the shield drivers can sink several mA VOS may degrade severely at loads above 100 mA (see Shield Driver Loading Error curve in Typical Performance Characteristics) Because the shield drivers are one diode drop above the input levels unbalanced leakage paths from shield to input can produce an input offset at high source impedances Buffering with emitter-followers ( Figure 8b ) re- duces this leakage current by reducing the voltage differen- tial and eliminates any loading on the amplifier TLH5609 – 16 FIGURE 8 Driving Shielded Cables MISCELLANEOUS TRIMMING The VOS adjust and shield driver pins available on the 16- pin package may be used to trim the other parameters be- sides offset voltage as illustrated in Figure 10 The bias-cur- rent trim relies on the fact that the voltage on the shield driver and gain setting pins is one diode drop respectively above and below the input voltage Input bias current can be held to within 100 pA over the entire common-mode range and input offset current always stays under 30 pA The CMRR trims use the shield driver pins to drive the VOS adjust pins thus maintaining the LM363’s ultra-high input impedance 13 |
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