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LM2716 Datasheet(PDF) 14 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No. de pieza LM2716
Descripción Electrónicos  Dual (Step-up and Step-down) PWM DC/DC Converter
PDF  17 Pages
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Fabricante Electrónico  NSC [National Semiconductor (TI)]
Página de inicio  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2716 Datasheet(HTML) 14 Page - National Semiconductor (TI)

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Boost Operation (Continued)
mc ) 0.072F
SW (in V/s)
where R
L is the minimum load resistance, VIN is the maxi-
mum input voltage, g
m is the error amplifier transconduc-
tance found in the Electrical Characteristics table, and R
D-
SON
is the value chosen from the graph "R
DSON2 vs. VIN "in
the Typical Performance Characteristics section.
LAYOUT CONSIDERATIONS
The LM2716 uses two separate ground connections, PGND
for the drivers and boost NMOS power device and AGND for
the sensitive analog control circuitry. The AGND and PGND
pins should be tied directly together at the package. The
feedback and compensation networks should be connected
directly to a dedicated analog ground plane and this ground
plane must connect to the AGND pin. If no analog ground
plane is available then the ground connections of the feed-
back and compensation networks must tie directly to the
AGND pin. Connecting these networks to the PGND can
inject noise into the system and effect performance.
The input bypass capacitor C
IN, as shown in Figure 3, must
be placed close to the IC. This will reduce copper trace
resistance which effects input voltage ripple of the IC. For
additional input voltage filtering, a 100nF bypass capacitor
can be placed in parallel with C
IN, close to the VIN pin, to
shunt any high frequency noise to ground. The output ca-
pacitors, C
OUT1 and COUT2, should also be placed close to
the IC. Any copper trace connections for the C
OUTX capaci-
tors can increase the series resistance, which directly effects
output voltage ripple. The feedback network, resistors R
FB1
and R
FB2, should be kept close to the FB pin, and away from
the inductor, to minimize copper trace connections that can
inject noise into the system. Trace connections made to the
inductors and schottky diodes should be minimized to re-
duce power dissipation and increase overall efficiency. See
Figure 3, Figure 4, and Figure 5 for a good example of
proper layout. For more detail on switching power supply
layout considerations see Application Note AN-1149: Layout
Guidelines for Switching Power Supplies.
Application Information
Some recommended Inductors (others may be used)
Manufacturer
Inductor
Contact Information
Coilcraft
DO3316 and DO5022 series
www.coilcraft.com
Coiltronics
DRQ73 and CD1 series
www.cooperet.com
Pulse
P0751 and P0762 series
www.pulseeng.com
Sumida
CDRH8D28 and CDRH8D43 series
www.sumida.com
Some recommended Input and Output Capacitors (others may be used)
Manufacturer
Capacitor
Contact Information
Vishay Sprague
293D, 592D, and 595D series tantalum
www.vishay.com
Taiyo Yuden
High capacitance MLCC ceramic
www.t-yuden.com
Cornell Dubilier
ESRD seriec Polymer Aluminum Electrolytic
SPV and AFK series V-chip series
www.cde.com
Panasonic
High capacitance MLCC ceramic
EEJ-L series tantalum
www.panasonic.com
www.national.com
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