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LM2716 Datasheet(PDF) 14 Page - National Semiconductor (TI) |
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LM2716 Datasheet(HTML) 14 Page - National Semiconductor (TI) |
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14 / 17 page ![]() Boost Operation (Continued) mc ) 0.072F SW (in V/s) where R L is the minimum load resistance, VIN is the maxi- mum input voltage, g m is the error amplifier transconduc- tance found in the Electrical Characteristics table, and R D- SON is the value chosen from the graph "R DSON2 vs. VIN "in the Typical Performance Characteristics section. LAYOUT CONSIDERATIONS The LM2716 uses two separate ground connections, PGND for the drivers and boost NMOS power device and AGND for the sensitive analog control circuitry. The AGND and PGND pins should be tied directly together at the package. The feedback and compensation networks should be connected directly to a dedicated analog ground plane and this ground plane must connect to the AGND pin. If no analog ground plane is available then the ground connections of the feed- back and compensation networks must tie directly to the AGND pin. Connecting these networks to the PGND can inject noise into the system and effect performance. The input bypass capacitor C IN, as shown in Figure 3, must be placed close to the IC. This will reduce copper trace resistance which effects input voltage ripple of the IC. For additional input voltage filtering, a 100nF bypass capacitor can be placed in parallel with C IN, close to the VIN pin, to shunt any high frequency noise to ground. The output ca- pacitors, C OUT1 and COUT2, should also be placed close to the IC. Any copper trace connections for the C OUTX capaci- tors can increase the series resistance, which directly effects output voltage ripple. The feedback network, resistors R FB1 and R FB2, should be kept close to the FB pin, and away from the inductor, to minimize copper trace connections that can inject noise into the system. Trace connections made to the inductors and schottky diodes should be minimized to re- duce power dissipation and increase overall efficiency. See Figure 3, Figure 4, and Figure 5 for a good example of proper layout. For more detail on switching power supply layout considerations see Application Note AN-1149: Layout Guidelines for Switching Power Supplies. Application Information Some recommended Inductors (others may be used) Manufacturer Inductor Contact Information Coilcraft DO3316 and DO5022 series www.coilcraft.com Coiltronics DRQ73 and CD1 series www.cooperet.com Pulse P0751 and P0762 series www.pulseeng.com Sumida CDRH8D28 and CDRH8D43 series www.sumida.com Some recommended Input and Output Capacitors (others may be used) Manufacturer Capacitor Contact Information Vishay Sprague 293D, 592D, and 595D series tantalum www.vishay.com Taiyo Yuden High capacitance MLCC ceramic www.t-yuden.com Cornell Dubilier ESRD seriec Polymer Aluminum Electrolytic SPV and AFK series V-chip series www.cde.com Panasonic High capacitance MLCC ceramic EEJ-L series tantalum www.panasonic.com www.national.com 14 |
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