THC63LVDR84C_Rev.1.20_E

Copyright©2016 THine Electronics, Inc.

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THine Electronics, Inc.

Security E

Reference Land Pattern

Figure 16. Reference of Land Pattern

The recommendation mounting method of THine device is reflow soldering.

The reference pattern is using the calculation result on condition of reflow soldering.

Notes

This land pattern design is a calculated value based on JEITA ET-7501.

Please take into consideration in an actual substrate design about enough the ease of mounting, the intensity of

connection, the density of mounting, and the solder paste used, etc…

The optimal land pattern size changes

with these parameters.

Please use the value shown by the land pattern as reference data.