DocID026384 Rev 1

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L6739

Connection diagram and pin description

30

2.2

Thermal data

8COMP

Error amplifier output.

9FB

Error amplifier inverting input.

10

VSEN

Output voltage monitor.

It manages OVP and UVP protections and PGOOD. Connect to the positive side of the

load for remote sensing. See Section 6 on page 13 for details.

11

FBG

Remote ground sense.

Connect to the negative side of the load for remote sensing.

12

CSN

Current sense negative input.

Connect to the output-side of the main inductor. Filter with 100 nF (typ.) to GND.

13

CSP

Current sense positive input.

Connect through an R-C filter to the phase-side of the main inductor.

14

OSC

(see Section 7 on page 16 for details). If floating, the switching frequency is 200 kHz.

15

VCC

Device power supply.

Operative voltage is 5 V to 12 V bus. Filter with 1

F MLCC to GND.

16

GND

All internal references, logic and driver return path are referenced to this pin. Connect to

the PCB GND ground plane and filter to VCC and VCCDR.

Thermal

PAD

The thermal pad connects the silicon substrate and makes good thermal contact with the

PCB. Use VIAs to connect to the PGND plane.

Table 2. Pin descriptions (continued)

Pin no.

Name

Function

Table 3. Thermal data

Symbol

Parameter

Value

Unit

Thermal resistance junction to ambient

(device soldered on 2s2p PC board)

45

°C/W

Thermal resistance junction to case

1

°C/W

Maximum junction temperature

150

°C

Storage temperature range

-40 to 150

°C

Junction temperature range

-40 to 125

°C