MP7612

6

Rev. 3.00

ELECTRICAL CHARACTERISTICS (CONT’D)

Specifications are subject to change without notice

NOTES:

1

Guaranteed; not tested.

2

Specified values guarantee functionality.

3

4

5

For power supply values <

6

Digital feedthrough and channel-to-channel crosstalk are heavily dependent on the board layout and environment.

ABSOLUTE MAXIMUM RATINGS (TA = +25

+16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

–16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

+6.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . .

+7.0 V

. . . . . . . . . . . . . . . . . . . . . . . . . . .

AGND to DGND

+1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

(Functionality guaranteed for

0.5 V only)

+0.5V

Analog Inputs & Outputs

Indefinite Shorts to

. . . . . . .

dissipation of the package spec is not exceeded)

Operating Temperature Range

Extended Industrial

–40

°C to +85°C

. . . . . . . . . . . . . .

Maximum Junction Temperature

–65

°C to 150°C

. . .

Storage Temperature

150

°C

. . . . . . . . . . . . . . . . . . . . . .

Lead Temperature (Soldering, 10 sec)

+300

°C

. . . . .

Package Power Dissipation Rating @ 75

°C

SOIC, PLCC

1150mW

. . . . . . . . . . . . . . . . . . . . . . . .

Derates above 75

°C

15mW/

°C

. . . . . . . . . . . . . . . . .

NOTES:

1

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

2

Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps

(HP5082-2835) from input pin to the supplies.

All inputs have protection diodes which will protect the device from short

transients outside the supplies of less than 100mA for less than 100

APPLICATION NOTES

Refer to Section 8 in the 1995 Data Acquisition products Databook for Applications Information

NOTE: When using these DACs to drive remote devices, the accuracy of the output can be improved by utilizing a remote analog

ground connection. The difference between the DGND and AGND should be limited to

300 mV to assure normal operation. If there

is any chance that the AGND to DGND can be greater than

1 V, we recommend two back-to-back diodes be used between DGND

and AGND to clamp the voltage and prevent damage to the DAC. Using a buffer between the remote ground location and AGND may

help reduce noise induced from long lead or trace lengths.