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ST33TPHF2ESPI Datasheet(PDF) 9 Page - STMicroelectronics

No. de pieza ST33TPHF2ESPI
Descripción Electrónicos  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI Datasheet(HTML) 9 Page - STMicroelectronics

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5
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
5.1
TSSOP28 package information
TSSOP28 is a 28-pin, 9.7 × 6.4 mm, 4.4 mm body width, 0.65 mm pitch, thin shrink small outline package.
Unless otherwise specified, general tolerance is ± 0.1 mm.
Figure 5. TSSOP28 - outline
c
L
k
A1
aaa
A2
A
e
b
1
28
14
15
D
E
E1
L1
1.
Drawing is not to scale.
Table 2. TSSOP28 - mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
-
-
1.200
-
-
0.0472
A1
0.050
-
0.150
0.0020
-
0.0059
A2
0.800
1.000
1.050
0.0315
0.0394
0.0413
b
0.190
-
0.300
0.0075
-
0.0118
c
0.090
-
0.200
0.0035
-
0.0079
D
9.600
9.700
9.800
0.3780
0.3819
0.3858
E
6.200
6.400
6.600
0.2441
0.2520
0.2598
E1
4.300
4.400
4.500
0.1693
0.1732
0.1772
e
-
0.650
-
-
0.0256
-
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
-
1.000
-
-
0.0394
-
ST33TPHF2ESPI
Package information
DB2716 - Rev 4
page 9/26



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