Motor de Búsqueda de Datasheet de Componentes Electrónicos
  Mexican  ▼
ALLDATASHEET.COM.MX

X  

ST33TPHF2ESPI Datasheet(PDF) 25 Page - STMicroelectronics

No. de pieza ST33TPHF2ESPI
Descripción Electrónicos  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI Datasheet(HTML) 25 Page - STMicroelectronics

Back Button ST33TPHF2ESPI Datasheet HTML 18Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 19Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 20Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 21Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 22Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 23Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 24Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 25Page - STMicroelectronics ST33TPHF2ESPI Datasheet HTML 26Page - STMicroelectronics  
Zoom Inzoom in Zoom Outzoom out
 25 / 26 page
background image
List of figures
Figure 1.
TSSOP28 pinout................................................................... 5
Figure 2.
VQFN32 pinout.................................................................... 5
Figure 3.
Typical hardware implementation (TSSOP28 package) ........................................ 7
Figure 4.
Mandatory filtering capacitors on VPS .................................................... 8
Figure 5.
TSSOP28 - outline ................................................................. 9
Figure 6.
TSSOP28 - recommended footprint..................................................... 10
Figure 7.
VFQFPN32 - outline ............................................................... 11
Figure 8.
VFQFPN32 - recommended footprint.................................................... 12
Figure 9.
Reel diagram .................................................................... 14
Figure 10.
Embossed carrier tape for VFQFPN 5 × 5 mm ............................................. 15
Figure 11.
Chip orientation in the embossed carrier tape for VFQFPN 5 × 5 mm.............................. 15
Figure 12.
Embossed carrier tape for TSSOP28 4.4 mm body width ...................................... 16
Figure 13.
Chip orientation in the embossed carrier tape for TSSOP28 4.4 mm body width ...................... 16
Figure 14.
TSSOP28 device package marking area ................................................. 17
Figure 15.
VQFN32 device package marking area .................................................. 17
ST33TPHF2ESPI
List of figures
DB2716 - Rev 4
page 25/26



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26


Datasheet Descarga

Go To PDF Page


Enlace URL



¿ALLDATASHEET es útil para Ud.?  [ DONATE ] 

Todo acerca de Alldatasheet   |   Publicidad   |   Contáctenos   |   Política de Privacidad   |   Enlace a la hoja de datos    |   Intercambio de Enlaces   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com