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ST33TPHF2ESPI Datasheet(PDF) 13 Page - STMicroelectronics

No. de pieza ST33TPHF2ESPI
Descripción Electrónicos  Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
PDF  26 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST33TPHF2ESPI Datasheet(HTML) 13 Page - STMicroelectronics

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5.3
Thermal characteristics of packages
The table below provides the thermal characteristics of the TSSOP28 and VFQFPN32 packages.
Table 4. Thermal characteristics
Parameter
Symbol
Value
Recommended operating temperature range
Ambient temperature
TA
−40 to 105 °C
Case temperature
TC
-
Junction temperature
TJ
−43 to 108 °C
Absolute maximum junction temperature
-
125 °C
Maximum power dissipation
-
63 mW
Theta-JA, -JB and -JC
Junction to ambient thermal resistance
θJA
35.8 at 0 lfpm (1)
Junction to case thermal resistance
θJC
1.48 at 0 lfpm(1)
Junction to board thermal resistance
θJB
13.9 at 0 lfpm(1)
1. Linear feet per minute.
ST33TPHF2ESPI
Thermal characteristics of packages
DB2716 - Rev 4
page 13/26



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