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TMUX7411F Datasheet(PDF) 23 Page - Texas Instruments |
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TMUX7411F Datasheet(HTML) 23 Page - Texas Instruments |
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23 / 30 page ![]() 9.3.2.2 Powered-Off Protection When the supplies of TMUX7411F, TMUX7412F, and TMUX7413F are removed (VDD/ VSS = 0 V or floating), the source (Sx) pins of the device remain in high impedance (Hi-Z) state, and the device performance remains within the leakage performance. Powered-off protection minimizes system complexity by removing the need to control power supply sequencing of the system. The feature prevents errant voltages on the input source pins from reaching the rest of the system and maintains isolation when the system is powering up. Without powered-off protection, signal on the input source pins can back-power the supply rails through internal ESD diodes and cause potential damage to the system. The switch remains OFF regardless of whether the VDD and VSS supplies are 0 V or floating. A GND reference must always be present to ensure proper operation. Source and drain voltage levels of up to ±60 V are blocked in the powered-off condition. 9.3.2.3 Fail-Safe Logic Fail-safe logic circuitry allows voltages on the digital control pins to be applied before the supply pins, protecting the device from potential damage. The switch is specified to be in the OFF state, regardless of the state of the digital logic signals. The digital inputs are protected against positive faults of up to +44 V in powered-off condition, but do not offer protection against negative overvoltage condition. 9.3.2.4 Overvoltage Protection and Detection The TMUX7411F, TMUX7412F, and TMUX7413F detect overvoltage inputs by comparing the voltage on a source pin (Sx) with the supplies (VDD and VSS). A signal is considered overvoltage if it exceeds the supply voltages by the threshold voltage (VT). The switch automatically turns OFF regardless of the logic controls when an overvoltage is detected. The source pin becomes high impedance and ensures only small leakage current flows through the switch. The drain pin (Dx) is pulled to the supply that was exceeded when the fault channel is selected by the logic control. For example, if the source voltage exceeds VDD, the drain output is pulled to VDD. If the source voltage exceeds VSS, the drain output is pulled to VSS. The pull-up impedance is approximately 40 kΩ, and as a result, the drain current is limited to roughly 1 mA during a shorted load (to GND) condition. 9.3.2.5 Latch-up Immunity Latch-up is a condition where a low impedance path is created between a supply pin and ground. This condition is caused by a trigger (current injection or overvoltage), but once activated, the low impedance path remains even after the trigger is no longer present. This low impedance path may cause system upset or catastrophic damage due to excessive current levels. The Latch-up condition typically requires a power cycle to eliminate the low impedance path. In the TMUX7411F, TMUX7412F, and TMUX7413F devices, an insulating oxide layer is placed on top of the silicon substrate to prevent any parasitic junctions from forming. As a result, the devices are latch-up immune under all circumstances by device construction. 9.3.3 Overvoltage Fault Flags The voltages on the source input pins of the TMUX7411F, TMUX7412F, and TMUX7413F are continuously monitored, and the status of whether an overvoltage condition occurs is indicated by an active low general fault flag (FF). The voltage on the FF pin indicates if any of the source input pins are experiencing an overvoltage condition. If any source pin voltage exceeds the fault supply voltages by a VT, the FF output is pulled-down to below VOL. The FF pin is an open-drain output and an external pull-up resistor of 1 kΩ is recommended. The pull-up voltage can be in the range of 1.8 V to 5.5 V, depending on the controller voltage the device interfaces with. www.ti.com TMUX7411F, TMUX7412F, TMUX7413F SCDS404 – MARCH 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: TMUX7411F TMUX7412F TMUX7413F |
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