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HMC525ALC4TR-R5 Datasheet(PDF) 26 Page - Analog Devices |
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HMC525ALC4TR-R5 Datasheet(HTML) 26 Page - Analog Devices |
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26 / 28 page ![]() HMC525ALC4 Data Sheet Rev. A | Page 26 of 28 APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT Figure 101 shows the typical application circuit for the HMC525ALC4. To select the appropriate sideband, an external 90° degree hybrid is needed. For applications not requiring operation to dc, use an off-chip dc blocking capacitor. For applications that require suppression of the LO signal at the output, use a bias tee or RF feed as shown in Figure 101. Ensure that the source or sink current used for LO suppression is <2 mA for each IF port to prevent damage to the device. The common-mode voltage for each IF port is 0 V. To select the upper sideband when using as an upconverter, connect the IF1 pin to the 90° port of the hybrid, and connect the IF2 pin to the 0° port of the hybrid. To select the lower sideband, connect IF1 to the 0° port of the hybrid and IF2 to the 90° port of the hybrid. The input is from the sum port of the hybrid and the difference port is 50 Ω terminated. To select the upper sideband (low-side LO) when using as downconverter, connect the IF1 pin to the 0° port of the hybrid, and connect the IF2 pin to the 90° port of the hybrid. To select the lower sideband (high-side LO), connect the IF1 pin to the 90° port of the hybrid and IF2 to the 0° port of the hybrid. The output is from the sum port of the hybrid, and the difference port is 50 Ω terminated. 13 1 3 4 2 5 6 14 15 16 17 18 90° HYBRID RF LO GND IF1 IF2 PACKAGE BASE 50Ω IF SUPPLY FOR IF1 SUPPLY FOR IF2 BIAS TEE/ DC FEED FOR IF2 BIAS TEE/ DC FEED FOR IF1 DC BLOCKING CAPACITORS EXTERNAL 90° HYBRID NOTES 1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING. Figure 101. Typical Application Circuit EVALUATION PCB INFORMATION Use RF circuit design techniques for the circuit board used in the application. Ensure that signal lines have 50 Ω impedance and connect the package ground leads and the exposed pad directly to the ground plane (see Figure 103). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 103 is available from Analog Devices, Inc., upon request. Table 7. Materials for Evaluation PCB EV1HMC525ALC4 Item Description PCB1 PCB, 109996-1 J1, J2 2.92 mm SubMiniature Version A (SMA) connectors, SRI connector gage J3, J4 Gold plated SMA, edge mount with 0.02 inch pin connectors, Johnson SMA connectors U1 Device under test, HMC525ALC4 1 109996-1 is the raw bare PCB identifier. Reference EV1HMC525ALC4 when ordering complete evaluation PCB. |
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