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HMC525ALC4TR-R5 Datasheet(PDF) 4 Page - Analog Devices

No. de pieza HMC525ALC4TR-R5
Descripción Electrónicos  4 GHz to 8.5 GHz, GaAs, MMIC, I/Q Mixer
PDF  28 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
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HMC525ALC4TR-R5 Datasheet(HTML) 4 Page - Analog Devices

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HMC525ALC4
Data Sheet
Rev. A | Page 4 of 28
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
RF Input Power
20 dBm
LO Input Power
25 dBm
IF Input Power
20 dBm
IF Source and Sink Current
2 mA
Reflow Temperature
260°C
Maximum Junction Temperature (TJ)
175°C
Lifetime at Maximum (TJ)
>1 × 106 hours
Moisture Sensitivity Level (MSL)1
3
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 6.22 mW/°C Above 85°C)2
560 mW
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature Range
−65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
250 V
Field Induced Charged Device Model
(FICDM)
500 V
1
Based on IPC/JEDEC J-STD-20 MSL Classifications.
2
PDISS is a theoretical number calculated by (TJ − 85°C)/θJC.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any
other conditions above those indicated in the operational section of
this specification is not implied. Operation beyond the maximum
operating conditions for extended periods may affect product
reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
E-24-11
120
161
°C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION



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