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HMC525ALC4TR-R5 Datasheet(PDF) 4 Page - Analog Devices |
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HMC525ALC4TR-R5 Datasheet(HTML) 4 Page - Analog Devices |
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4 / 28 page ![]() HMC525ALC4 Data Sheet Rev. A | Page 4 of 28 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating RF Input Power 20 dBm LO Input Power 25 dBm IF Input Power 20 dBm IF Source and Sink Current 2 mA Reflow Temperature 260°C Maximum Junction Temperature (TJ) 175°C Lifetime at Maximum (TJ) >1 × 106 hours Moisture Sensitivity Level (MSL)1 3 Continuous Power Dissipation, PDISS (TA = 85°C, Derate 6.22 mW/°C Above 85°C)2 560 mW Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature Range −65°C to +150°C Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) 250 V Field Induced Charged Device Model (FICDM) 500 V 1 Based on IPC/JEDEC J-STD-20 MSL Classifications. 2 PDISS is a theoretical number calculated by (TJ − 85°C)/θJC. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 3. Thermal Resistance Package Type θJA θJC Unit E-24-11 120 161 °C/W 1 See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance (PCB with 3 × 3 vias). ESD CAUTION |
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