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HMC525ALC4TR-R5 Datasheet(PDF) 1 Page - Analog Devices |
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HMC525ALC4TR-R5 Datasheet(HTML) 1 Page - Analog Devices |
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1 / 28 page ![]() 4 GHz to 8.5 GHz, GaAs, MMIC, I/Q Mixer Data Sheet HMC525ALC4 Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibilityisassumedbyAnalogDevicesforitsuse,norforanyinfringementsofpatentsorother rightsofthirdpartiesthatmayresultfromitsuse.Specificationssubjecttochangewithoutnotice.No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Passive: no dc bias required Conversion loss: 8 dB (typical) Input IP3: 20 dBm (typical) LO to RF isolation: 47 dB (typical) IF frequency range: dc to 3.5 GHz RoHS compliant, 24-terminal, 4 mm × 4 mm LCC package APPLICATIONS Microwave and very small aperture terminal radios Test equipment Point to point radios Military electronic warfare; electronic countermeasure; and command, control, communications, and intelligence FUNCTIONAL BLOCK DIAGRAM 13 1 3 4 2 NIC NIC GND RF 5 6 GND NIC NIC 14 GND 15 LO 16 GND 17 NIC 18 NIC GND PACKAGE BASE 90° HYBRID HMC525ALC4 Figure 1. GENERAL DESCRIPTION The HMC525ALC4 is a compact gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), in phase quadrature (I/Q) mixer in a 24-terminal, RoHS compliant, ceramic leadless chip carrier (LCC) package. The device can be used as either an image reject mixer or a single sideband (SSB) upconverter. The mixer uses two standard double balanced mixer cells and a 90° hybrid fabricated in a GaAs, metal semiconductor field effect transistor (MESFET) process. The HMC525ALC4 is a much smaller alternative to a hybrid style image reject mixer and a SSB upconverter assembly. The HMC525ALC4 eliminates the need for wire bonding, allowing the use of surface-mount manufacturing techniques. |
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