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M95128-DF Datasheet(PDF) 39 Page - STMicroelectronics |
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M95128-DF Datasheet(HTML) 39 Page - STMicroelectronics |
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39 / 48 page ![]() 10.4 WLCSP8 (CS) package information WLCSP8 is a 8 bumps, 1.289 x 1.099 mm, 0.4 mm pitch wafer level chip scale package Figure 29. WLCSP8 - Outline (4X) aaa Wafer back side D E Side view Detail A A2 A e1 e2 e G F Bump side H e3 bbb Z X Y Reference Orientation Detail A Rotated 90 ° A1 Bump Seating plane Z eee Z Z Z X ccc M Y Ø Ø ddd M b 1. Drawing is not to scale 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 3. Bump position designation per JESD 95-1, SPP-010. M95128-W M95128-R M95128-DF WLCSP8 (CS) package information DS1356 - Rev 20 page 39/48 |
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