STM32H7B3AI datasheet(194/238 Pages) STMICROELECTRONICS

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Table 130. TFBGA100 - Mechanical data

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

A(2)

1.100

0.0433

A1(3)

0.150

0.0059

0.760

0.0299

b(4)

0.350

0.400

0.450

0.0138

0.0157

0.0177

7.850

8.000

8.150

0.3091

0.3150

0.3209

7.200

0.2835

7.850

8.000

8.150

0.3091

0.3150

0.3209

7.200

0.2835

0.800

0.0315

0.400

0.0157

0.400

0.0157

ddd

0.100

0.0039

eee(5)

0.150

0.0059

fff(6)

0.080

0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. The total profile height (Dim A) is measured from the seating plane to the top of the component.

3. •

The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or

other feature of package body or integral heat slug.

•

A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact

shape of each corner is optional.

4. Initial ball equal 0.350mm.

5. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B. For each ball there

is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datums A and B as

defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.

6. The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball

there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis

perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained

entirely in the respective zone eee above The axis of each ball must lie simultaneously in both tolerance zones.

Figure 89. TFBGA100 - Recommended footprint

Dsm

Dpad

STM32H7B3xI

TFBGA100 package information

DS13139 - Rev 8

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