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STM32H7B3AI Datasheet(PDF) 208 Page - STMicroelectronics |
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STM32H7B3AI Datasheet(HTML) 208 Page - STMicroelectronics |
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208 / 238 page ![]() 7.7 TFBGA216 package information This TFBGA is a 216 ball, 13x13 mm, 0.8 mm pitch, fine pitch ball grid array package. Figure 100. TFBGA216 - Outline Seating plane A1 e F G D R Øb (216 balls) A E TOP VIEW BOTTOM VIEW 1 15 e A A2 Y X Z ddd Z D1 E1 eee Z Y X fff Ø Ø M M Z A1 ball identifier A1 ball index area 1. Drawing is not to scale. 2. – The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized markings, or other feature of package body or integral heat slug. – A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. STM32H7B3xI TFBGA216 package information DS13139 - Rev 8 page 208/238 |
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