1998 Jan 29

11

Philips Semiconductors

Product specification

UHF power MOS transistor

BLF404

MOUNTING RECOMMENDATIONS

Both the metallized groundplate and leads contribute to the heatflow. It is recommended that the transistor is mounted

on a grounded metallized area of a maximum thickness of 0.8 mm on the printed-circuit board, equipped with at least 12

(0.5 mm diameter) through metallized holes filled with solder.

on the printed-circuit board.

Fig.15 Reflow soldering footprint for SOT409A.

Dimensions in mm.

full pagewidth

MGK390

1.87 (2

×)

4.60

0.80 (2

×)

0.60 (4

×)

0.50 (12

×)

1.00 (8

×)

1.00 (9

×)

3.60

7.38