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STM32H523VCU6 Datasheet(PDF) 222 Page - STMicroelectronics

No. de pieza STM32H523VCU6
Descripción Electrónicos  Arm Cortex -M33 32-bit MCUTrustZone FPU, 375 DMIPS Arm Cortex -M33 32-bit MCUTrustZone FPU, 375 DMIPS
PDF  228 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H523VCU6 Datasheet(HTML) 222 Page - STMicroelectronics

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Package information
STM32H523xx
222/228
DS14540 Rev 1
integral heat slug. A distinguish feature is allowable on the bottom surface of the
package to identify the terminal A1 corner. Exact shape of each corner is optional.
9.
e represents the solder ball grid pitch.
10. N represents the total number of balls on the BGA.
11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the
position of the centre ball(s) in the outer row or column of a fully populated matrix.
12. Values in inches are converted from mm and rounded to 4 decimal digits.
13. Drawing is not to scale.
Figure 76. UFBGA144 - Footprint example
Table 128. UFBGA144 - Example of PCB design rules (0.80 mm pitch BGA)
Dimension
Values
Pitch
0.80 mm
Dpad
0.400 mm
Dsm
0.550 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.400 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.120 mm
BGA_WLCSP_FT_V1
Dsm
Dpad



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