SDP511 datasheet(7/10 Pages) ETC2

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Version 1.9 – July 2015

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7. Mechanical Specifications

7.1

Mechanical concept

The SDP600 Series is designed for through-hole

technology and can be wave-soldered or hand-soldered to

a PCB.

 The SDP60x/SDP50x can be directly connected

to a manifold using two O-rings.

 The SDP61x/SDP51x sensors have ports for

connecting standard-size plastic tubes.

7.2

Mechanical characteristics

Parameter

PCB attachment

Clip-in and hand or wave soldering.

Additional mechanical attachment

depending on force requirements

Allowable

overpressure

1 bar (100 kPa, 400 inches H2O)

Rated burst pressure

> 5 bar

Gas flow through

sensor

< 150 ml/min

Weight

< 6 g

Protection rating

IP 30

7.3

SDP60x/SDP50x – Manifold connection

Figure 1: SDP60x/SDP50x manifold mount version. All

dimensions are in mm.

Sensirion recommends O-rings with the following

dimensions:

d1: 3–4 mm

d2: 2 mm

Figure 2: Cross section of recommended O-ring

7.4

SDP61x/SDP51x – Tube connection

Figure 3: SDP61x/SDP51x version with ports for tube

connection. All dimensions are in mm.

7.5

Pin assignments

Figure 4: Digital output pin assignments (bottom view).

7.6

Footprint

Figure 5: Footprint for PCB mounting. (top view = sensor side).

All dimensions in mm.

A: Overall sensor dimensions

B: Holes for additional mounting screws (optional)

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