SDP511 datasheet(8/10 Pages) ETC2

8 / 10 page

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Version 1.9 – July 2015

8/10

8. Instructions for Use

8.1

Soldering instructions

Standard wave soldering systems may be used for

soldering SDP600 series sensors. Reflow soldering is not

feasible and may damage the sensor.

The sensor ports must be protected from solder splash

and flux during soldering. Figure 6 shows an appropriate

temperature profile with maximum temperature values.

Figure 6: Suitable wave soldering profile.

The characteristics of wave soldering machines vary, so

any soldering setup must be tested before production use.

8.2

Sensor handling

The sensors of the SDP600 series are designed to be

robust and vibration resistant. Nevertheless, the accuracy

of the high-precision SDP600 series can be degraded by

rough handling. Sensirion does not guarantee proper

operation in case of improper handling. Note: avoid

applying any mechanical stress to the solder joints of the

sensor during or as a result of PCB assembly.

The sensor ships in an antistatic package to prevent

electrostatic discharge (ESD), which can damage the part.

To avoid such damage, ground yourself using a grounding

strap or by touching a grounded object. Furthermore store

the parts in the antistatic package when not in use.

8.3

Additional attachment

If necessary, the robustness of the sensor attachment to

the PCB can be increased by using a bracket as shown in

Figure 7.

Sensirion recommends using this additional bracket when

the sensor is fitted to a PCB. The bracket must be secured

before the pins are soldered to the PCB, as otherwise

sensor performance may be degraded by mechanical

stress.

Figure 7: Supplementary bracket for the SDP600 series.

8.4

Air flow and tubing

Due to the dynamic measurement principle, a small air

flow is required.

Figure 8:Typical air flow through the SDP600 series sensor.

Note: 1 sccm = 1 cm3/min at 0°C and 1013 mbar

(1 sccm = 0.001 standard liter).

This air flow through the sensor creates a dependence on

the tube length. The error is less than 1% with a tube

length up to 1 m (with 3/16 inch inside diameter).

-120

+120

-600

+600

Pressure difference (Pa)

200°C

150°C

100°C

50°C

0°C

250°C

Start

Flux zone

Preheat zone

Entrance to solder

Wave

Exit from solder

Wave

Solder Wave Peak

Temp. max. 260°C

Max 145°C

Approx. PCB

bottom-side temp.

PCB top-side

temperature

Approx.

1 min

(Time in wave < 2 s)

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