TMP93CS32F datasheet(13/48 Pages) TOSHIBA

13 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-13

2002-02-20

Table 2.4

Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method (2/2)

Products

Name

Package no.

Air reflow

Infrared reflow

TMP90PH48F

P-QFP80-1420-0.80B

A(168h)

TMP91P642F

P-QFP64-1420-1.00A

B(72h)

TMP91C642AF

P-QFP64-1420-1.00A

A(168h)

TMP90PM42F

P-QFP64-1420-1.00A



TMP90PM42DF

P-QFP100-2222-0.80A

A(168h)

TMP90CH42F

P-QFP100-1420-0.65A

A(168h)

TMP90CH42DF

P-QFP100-2222-0.80A

A(168h)

TMP90CK42F

P-QFP100-1420-0.65A



TMP90CK42DF

P-QFP100-2222-0.80A

A(168h)

TMP90PS74DF

P-QFP100-2222-0.80A

A(168h)

TMP90CM36T

P-QFJ84-S115-1.27

A(168h)

TMP90CM37T

P-QFJ84-S115-1.27

A(168h)

TMP90PM36T

P-QFJ84-S115-1.27

A(168h)

TMP90CM38T

P-QFJ84-S115-1.27

A(168h)

TMP90CM39T

P-QFJ84-S115-1.27

A(168h)

TMP90PM38T

P-QFJ84-S115-1.27

A(168h)

TMP90CS36T

P-QFJ84-S115-1.27

A(168h)

TMP90CS37T

P-QFJ84-S115-1.27

A(168h)

TMP90PS36T

P-QFJ84-S115-1.27

A(168h)

TMP90CS38T

P-QFJ84-S115-1.27

A(168h)

TMP90CS39T

P-QFJ84-S115-1.27

A(168h)

TMP90PS38T

P-QFJ84-S115-1.27

A(168h)

Note 1:

As of September, 2001

Note 2:

Ensure

that

the

conditions

for

top/bottom

heating

using

the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h),

G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device.

For

details of these conditions, please refer to Table 2.2.

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