TMP93CS32F datasheet(22/48 Pages) TOSHIBA

22 / 48 page

Quality and Reliability Assurance / Handling Precautions

030901

QUA-22

2002-02-20

(7)

68000 Series

Table 2.9

Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

TMP68301AF-xx

P-QFP100-2222-0.80A

A(168h)

TMP68301AKF-xx

P-QFP100-2222-0.80A

A(168h)

TMP68303DF-xx

P-QFP100-2222-0.80A

A(168h)

TMP68305F-xx

P-QFP100-2222-0.80A

A(168h)

TMP68301AFR-xx

P-QFP100-1420-0.65A

A(168h)

TMP68301AKFR-xx

P-QFP100-1420-0.65A

A(168h)

TMP68HC003F-xx

P-QFP80-1420-0.80B

A(168h)

TMP68204F-xx

P-QFP160-2828-0.65A

A(168h)

Note 1:

As of February, 1998

Note 2:

Ensure

that

the

conditions

for

top/bottom

heating

using

the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h),

G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device.

For

details of these conditions, please refer to Table 2.2.

(8)

Z80 Series

Table 2.10

Storage conditions, permissible usage Period after unpacking and baking

requirements for each soldering method

Products

Name

Package no.

Air reflow

Infrared reflow

TMPZ84C011BF

P-QFP100-1420-0.65A

A(168h)

TMPZ84C015BF

P-QFP100-1420-0.65A

A(168h)

TMPZ84C013AT

P-QFJ84-S115-1.27

A(168h)

TMPZ84C112AF

P-QFP64-1420-1.00A

A(168h)

TMPZ84C711AF

P-QFP144-2626-0.65B

A(168h)

TMPZ84C810AF

P-QFP100-1420-0.65A

A(168h)

Note 1:

As of September, 1994

Note 2:

Ensure

that

the

conditions

for

top/bottom

heating

using

the

long/medium infrared reflow method are strictly adhered to, even when

this method is used in combination with the air reflow method.

Note 3:

Symbols A (168h), B (72h), C (48h), D (24h), E(12h),

G and  indicate

the maximum permissible period between unpacking and mounting of

the device, and the required storage conditions for the device.

For

details of these conditions, please refer to Table 2.2.

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