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TMP93CS32F Datasheet(PDF) 35 Page - Toshiba Semiconductor

No. de pieza TMP93CS32F
Descripción Electrónicos  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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Fabricante Electrónico  TOSHIBA [Toshiba Semiconductor]
Página de inicio  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMP93CS32F Datasheet(HTML) 35 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-35
2002-02-20
4.3
Design
Care must be exercised in the design of electronic equipment to achieve the desired
reliability. It is important not only to adhere to specifications concerning absolute
maximum ratings and recommended operating conditions, it is also important to
consider the overall environment in which equipment will be used, including factors
such as the ambient temperature, transient noise and voltage and current surges,
as well as mounting conditions which affect device reliability. This section describes
some general precautions which you should observe when designing circuits and
when mounting devices on printed circuit boards.
For more detailed information about each product family, refer to the relevant
individual technical datasheets available from Toshiba.
4.3.1
Absolute Maximum Ratings
Do not use devices under conditions in which their absolute maximum
ratings (e.g. current, voltage, power dissipation or temperature) will
be exceeded. A device may break down or its performance may be
degraded, causing it to catch fire or explode resulting in injury to the
user.
The absolute maximum ratings are rated values which
must not be exceeded during operation, even for an instant.
Although absolute maximum ratings differ from product to
product, they essentially concern the voltage and current
at each pin, the allowable power dissipation, and the
junction and storage temperatures.
If the voltage or current on any pin exceeds the absolute
maximum rating, the device’s internal circuitry can become degraded. In the
worst case, heat generated in internal circuitry can fuse wiring or cause the
semiconductor chip to break down.
If storage or operating temperatures exceed rated values, the package seal can
deteriorate or the wires can become disconnected due to the differences
between the thermal expansion coefficients of the materials from which the
device is constructed.
4.3.2
Recommended Operating Conditions
The recommended operating conditions for each device are those necessary to
guarantee that the device will operate as specified in the datasheet.
If greater reliability is required, derate the device’s absolute maximum ratings
for voltage, current, power and temperature before using it.
4.3.3
Derating
When incorporating a device into your design, reduce its rated absolute
maximum voltage, current, power dissipation and operating temperature in
order to ensure high reliability.
Since derating differs from application to application, refer to the technical
datasheets available for the various devices used in your design.



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