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STM8T141 Datasheet(PDF) 41 Page - STMicroelectronics

No. de pieza STM8T141
Descripción Electrónicos  Single-channel capacitive sensor for touch or proximity detection with shielded sensing electrode
PDF  50 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM8T141 Datasheet(HTML) 41 Page - STMicroelectronics

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STM8T141
Package characteristics
Doc ID 15699 Rev 7
41/50
10.2
Package thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 12: Operating characteristics on page 30.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated
using the following equation:
TJmax = TAmax + (PDmax x JA)
Where:
●
TAmax is the maximum ambient temperature in C
●
JA is the package junction-to-ambient thermal resistance in C/W
●
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
●
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
●
PI/Omax represents the maximum power dissipation on output pins
Where:
PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH), 
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in
the application.
10.2.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Table 25.
Thermal characteristics(1)
1.
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
JA
Thermal resistance junction-ambient
SO8 (Narrow)
130
°C/W
JA
Thermal resistance junction-ambient
UFDFPN 8 (2 x 3 mm)
120
°C/W



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