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AS4LC2M8S1 Datasheet(PDF) 8 Page - Alliance Semiconductor Corporation

No. de pieza AS4LC2M8S1
Descripción Electrónicos  3.3V 2M x 8/1M x 16 CMOS synchronous DRAM
PDF  28 Pages
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Fabricante Electrónico  ALSC [Alliance Semiconductor Corporation]
Página de inicio  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4LC2M8S1 Datasheet(HTML) 8 Page - Alliance Semiconductor Corporation

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ALLIANCE SEMICONDUCTOR
7/5/00
AS4LC2M8S1
AS4LC1M16S1
AC parameters common to all waveforms
Sym
Parameter
CAS
latency
–7
–8
–10
Unit
Notes
Min
Max
Min
Max
Min
Max
tAC CLK to valid output delay
3–
5.5
6
6
ns
6
2–
8.5
7
6
ns
6,8
1
18
22
22
ns
6,8
tAH Address hold time
1
1
1
ns
7
tAS Address setup time
2
2
2
ns
7
tBDL Last data-in to burst stop
0
0
0
tCK
9
tCCD
Read/write command to
read/write command
1–
1
1
tCK
9
tCDL
Last data-in to new
column address delay
1–
1
1
tCK
9
tCH CLK high-level width
2.75
3
3
ns
7
tCK CLK cycle time
3
7
1000
8
1000
10
1000
ns
10
2
8.7
1000
10
1000
12
1000
ns
10
1
20
1000
25
1000
25
1000
ns
10
tCKED
CKE to CLOCK disable or
power-down entry mode
1–
1
1
tCK
tCKH CKE hold time
1
1
1
ns
tCKS CKE setup time
2
2
2
ns
tCL
CLK low-level width
2.75
3
3.5
ns
7
tCMH
CS, RAS, CAS, WE, DQM
hold time
1–
1
1
ns
tCMS
CS, RAS, CAS, WE, DQM
setup time
2–
2
2
ns
tDAL
Data-in to ACTIVE
command
35
5
5
tCK
5,11
25
5
5
tCK
5,11
14
4
4
tCK
5,11
tDH Data in hold time
1
1
1
ns
tDPL Data in to PRECHARGE
2
2
2
tCK
12
tDQD DQM to input data delay
1
1
1
tCK
9
tDQM
DQM to data mask during
writes
0–
0
0
tCK
9
tDQZ
DQM to data high Z
during reads
2–
2
2
tCK
9
tDS Data in setup time
2
2
2
ns
tDWD
Write command to input
data delay
0–
0
0
tCK
9
tHZ
Data-out high-impedance
time
3–
5.5
6
9
ns
13
2–
8.5
9
9
ns
13
1
18
22
22
ns
13
tLZ
Data-out low-impedance
time
1–
1
1
ns



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