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FXLS8964AF Datasheet(PDF) 84 Page - NXP Semiconductors |
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FXLS8964AF Datasheet(HTML) 84 Page - NXP Semiconductors |
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84 / 98 page ![]() NXP Semiconductors FXLS8964AF 3-Axis Low-g Accelerometer FXLS8964AF All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved. Objective data sheet Rev. 2 — 30 October 2020 84 / 98 Table 118. SELF_TEST_CONFIG2 register (address 38h) bit description Field Description 3:0 ST_DEC Self-Test measurement phase decimation factor This bit field selects the Self-Test measurement phase decimation factor. The decimation selection ranges from 1 to 4096 as shown in the table below. Table 119. Self-Test measurement phase decimation settings ST_DEC[3] ST_DEC[2] ST_DEC[1] ST_DEC[0] Decimation selection (Number of samples Self-Test measurement period (ms) Self-Test ODR (Hz) 0 0 0 0 1 0.3125 3200 0 0 0 1 2 0.625 1600 0 0 1 0 4 1.25 800 0 0 1 1 8 2.5 400 0 1 0 0 16 5 200 0 1 0 1 32 10 100 0 1 1 0 64 20 50 0 1 1 1 128 40 25 1 0 0 0 256 80 12.5 1 0 0 1 512 160 6.25 1 0 1 0 1024 320 3.125 1 0 1 1 2048 640 1.563 1 1 0 0 4096 1280 0.78125 1 1 0 1 4096 1280 0.78 1 1 1 0 4096 1280 0.781 1 1 1 1 4096 1280 0.781 Note: • During the self-test sequence, the accelerometer measurement period in μs (for each axis and each direction) is given by the following equation: ST_PERIOD μs = 2ST_DEC[3:0] * [312.5 + (ST_IDLE[4:0] * 31.25) µs] • The user-selected ODR and power mode settings are ignored during self-test operation. The user-selected settings for ODR and power mode are applied after self- test is disengaged, for example, SENSCONFIG1[...]ST_AXIS_SEL[1:0] = 00b. 14 Printed circuit board layout and device mounting Printed Circuit Board (PCB) layout and device mounting are critical to the overall performance of the design. The footprint for the surface mount packages must be the correct size as a base for a proper solder connection between the PCB and the package. This, along with the recommended soldering materials and techniques, will optimize assembly and minimize the stress on the package after board mounting. |
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