FXLS8964AF datasheet(97/98 Pages) NXP

97 / 98 page

NXP Semiconductors

FXLS8964AF

3-Axis Low-g Accelerometer

FXLS8964AF

All information provided in this document is subject to legal disclaimers.

Objective data sheet

Rev. 2 — 30 October 2020

97 / 98

Contents

General description ............................................ 1

Features and benefits .........................................1

Typical applications ............................................2

3.1

Automotive convenience and security ............... 2

3.2

Industrial IOT ..................................................... 2

3.3

Medical ...............................................................2

3.4

Consumer devices .............................................2

Ordering information .......................................... 2

Block diagram ..................................................... 3

Pinning information ............................................ 4

6.1

Pinning ...............................................................4

6.2

Pin description ................................................... 4

System connections ........................................... 5

7.1

Typical application circuits .................................5

7.2

Power supply considerations .............................8

Sensing direction and output response ............8

Mechanical and electrical specifications .......... 9

9.1

Definitions .......................................................... 9

9.2

Absolute maximum ratings .............................. 10

9.3

Operating conditions ........................................11

9.4

Mechanical characteristics ...............................11

9.5

Electrical characteristics .................................. 12

9.6

Temperature sensor characteristics .................15

I2C digital interface ...........................................16

10.1

I2C interface characteristics ............................ 16

10.1.1

General I2C operation ..................................... 18

10.1.2

I2C read/write operations ................................ 18

10.1.2.1 Single byte read .............................................. 18

10.1.2.2 Multiple byte read ............................................ 18

10.1.2.3 Single byte write ..............................................19

10.1.2.4 Multiple byte write ............................................19

10.1.2.5 I2C data sequence diagrams ...........................20

SPI interface ...................................................... 20

11.1

General SPI operation .....................................20

11.2

SPI write operations with 3- or 4-wire mode .... 21

11.3

SPI read operations with 4-wire mode .............21

11.4

SPI read operations with 3-wire mode .............22

11.5

SPI timing specifications (4-wire mode and

3-wire hardwired modes) ................................. 23

11.6

SPI timing specifications (software enabled

3-wire mode) ....................................................24

Operating modes ...............................................26

13.1

INT_STATUS register (address 00h) ...............37

13.2

TEMP_OUT register (address 01h) ................. 39

13.3

VECM_LSB register (address 02h) ................. 39

13.4

VECM_MSB register (address 03h) ................ 40

13.5

OUT_X_LSB, OUT_X_MSB, OUT_Y_LSB,

OUT_Y_MSB, OUT_Z_LSB, OUT_Z_MSB

registers (addresses 04h to 09h) .....................40

13.6

BUF_STATUS register (address 0Bh) .............43

13.7

BUF_X_LSB, BUF_X_MSB, BUF_Y_LSB,

BUF_Y_MSB, BUF_Z_LSB, BUF_Z_MSB

(addresses 0Ch to 11h) ...................................44

13.8

PROD_REV register (address 12h) .................47

13.9

WHO_AM_I register (address 13h) ................. 47

13.10

SYS_MODE register (address 14h) .................48

13.11

SENS_CONFIG1 register (address 15h) ......... 49

13.12

SENS_CONFIG2 register (address 16h) ......... 51

13.13

SENS_CONFIG3 register (address 17h) ......... 52

13.14

SENS_CONFIG4 register (address 18h) ......... 55

13.15

SENS_CONFIG5 register (address 19h) ......... 57

13.16

WAKE_IDLE_LSB register (address 1Ah) ....... 58

13.17

WAKE_IDLE_MSB register (address 1Bh) ...... 58

13.18

SLEEP_IDLE_LSB register (address 1Ch) ......59

13.19

SLEEP_IDLE_MSB register (address 1Dh) ..... 59

13.20

ASLP_COUNT_LSB, ASLP_COUNT_MSB

registers (addresses 1Eh to 1Fh) .................... 59

13.21

INT_EN register (address 20h) ........................61

13.22

INT_PIN_SEL register (address 21h) .............. 63

13.23

OFF_X,

OFF_Y,

OFF_Z

registers

(addresses 22h to 24h) ................................... 64

13.24

BUF_CONFIG1 register (address 26h) ............65

13.25

BUF_CONFIG2 register (address 27h) ............67

13.26

ORIENT_STATUS register (address 28h) ....... 68

13.27

ORIENT_CONFIG register (address 29h) ....... 69

13.28

ORIENT_DBCOUNT register (address 2Ah) ... 70

13.29

ORIENT_BF_ZCOMP register (address

2Bh) ................................................................. 70

13.30

ORIENT_THS register (address 2Ch) ............. 71

13.31

Sensor Data Change Detection (SDCD)

registers ........................................................... 73

13.31.1 SDCD_INT_SRC1 register (address 2Dh) .......74

13.31.2 SDCD_INT_SRC2 register (address 2Eh) .......75

13.31.3 SDCD_CONFIG1 register (address 2Fh) .........77

13.31.4 SDCD_CONFIG2 register (address 30h) .........78

13.31.5 SDCD_OT_DBCNT register (address 31h) ..... 80

13.31.6 SDCD_WT_DBCNT register (address 32h) .....80

13.31.7 SDCD_LTHS_LSB register (address 33h) .......81

13.31.8 SDCD_LTHS_MSB register (address 34h) ......81

13.31.9 SDCD_UTHS_LSB register (address 35h) ...... 82

13.31.10 SDCD_UTHS_MSB register (address 36h) ..... 82

13.32

SELF_TEST_CONFIG1 register (address

37h) ..................................................................83

13.33

SELF_TEST_CONFIG2 register (address

38h) ..................................................................83

Printed circuit board layout and device

mounting ............................................................84

14.1

Overview of soldering considerations .............. 85

14.2

Halogen content .............................................. 85

14.3

PCB mounting recommendations .................... 85

Package information .........................................86

15.1

Package description ........................................ 87

15.2

Lead dimension detail ......................................90

15.3

Burr specification ............................................. 90

Revision history ................................................ 91

Legal information ..............................................92

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