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STM32F103XC Datasheet(PDF) 11 Page - STMicroelectronics

No. de pieza STM32F103XC
Descripción Electrónicos  High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces
PDF  143 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
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STM32F103XC Datasheet(HTML) 11 Page - STMicroelectronics

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STM32F103xC, STM32F103xD, STM32F103xE
Description
135
2.1
Device overview
The STM32F103xC/D/E high-density performance line family offers devices in six different
package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of
peripherals are included, the description below gives an overview of the complete range of
peripherals proposed in this family.
Figure 1 shows the general block diagram of the device family.
Table 2. STM32F103xC, STM32F103xD and STM32F103xE features
and peripheral counts
Peripherals
STM32F103Rx
STM32F103Vx
STM32F103Zx
Flash memory in Kbytes
256
384
512
256
384
512
256
384
512
SRAM in Kbytes
48
64
48
64
48
64
FSMC
No
Yes(1)
1. For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only
support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or
8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is
not available in this package.
Yes
Timers
General-purpose
4
Advanced-control
2
Basic
2
Comm
SPI(I2S)(2)
2. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the
I2S audio mode.
3(2)
I2C2
USART
5
USB
1
CAN
1
SDIO
1
GPIOs
51
80
112
12-bit ADC
Number of channels
3
16
3
16
3
21
12-bit DAC
Number of channels
2
2
CPU frequency
72 MHz
Operating voltage
2.0 to 3.6 V
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 10)
Junction temperature: –40 to + 125 °C (see Table 10)
Package
LQFP64, WLCSP64
LQFP100, BGA100
LQFP144, BGA144



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