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STM32H7B3AI Datasheet(PDF) 213 Page - STMicroelectronics

No. de pieza STM32H7B3AI
Descripción Electrónicos  32-bit Arm® Cortex®-M7 280 MHz MCUs, 2-Mbyte flash memory, 1.4-Mbyte RAM, 46 com. and analog interfaces, SMPS, crypto
PDF  238 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32H7B3AI Datasheet(HTML) 213 Page - STMicroelectronics

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Table 139. TFBGA225 - Recommended PCB design rules (0.8 mm pitch)
Dimension
Recommended values
Pitch
0.8 mm
Dpad
0.400 mm
Dsm
0.470 mm typ. (depends on the soldermask registration
tolerance)
Stencil opening
0.400 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
Pad trace width
0.120 mm
7.8.1
Device marking for TFBGA225
The following figure gives an example of topside marking versus pin 1 position identifier location.
The printed markings may differ depending on the supply chain.
Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below.
Figure 105. TFBGA225 marking example (package top view)
STM32H7B3
LIH6Q
Y WW
Revision code
Product identification(1)
Date code
Ball 1
indentifier
1.
Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples
in production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity.
STM32H7B3xI
TFBGA225 package information
DS13139 - Rev 8
page 213/238



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