STM32H7B3AI datasheet(215/238 Pages) STMICROELECTRONICS

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Table 140. UFBGA169 - Mechanical data

Symbol

millimeters

inches (1)

Min.

Typ.

Max.

Min.

Typ.

Max.

A(2)

0.600

0.0236

0.110

0.0043

0.130

0.0051

0.320

0.0126

b(3)

0.230

0.280

0.330

0.0091

0.0110

0.0130

6.850

7.000

7.150

0.2697

0.2756

0.2815

6.000

0.2362

6.850

7.000

7.150

0.2697

0.2756

0.2815

6.000

0.2362

0.500

0.0197

0.500

0.0197

ddd

0.080

0.0031

eee (4)

0.015

0.0059

fff(5)

0.050

0.0020

1. Values in inches are converted from mm and rounded to four decimal digits.

2. •

Ultra Thin profile: 0.50 < A ≤ 0.65 mm / Fine pitch: e < 1.00 mm pitch.

•

The total profile height (dim A) is measured from the seating plane to the top of the component

•

The maximum total package height is calculated by the following methodology:

•

A Max = A1 Typ + A2 Typ + A4 Typ + √ (A1²+A2²+A4² tolerance values)

3. The typical balls diameters before mounting is 0.20 mm.

4. The tolerance of position that controls the location of the pattern of balls with respect to datum A and B. For each ball there

is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datum A and B as

defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.

5. The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball

there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis

perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained

entirely in the respective zone eee above The axis of each ball must lie simultaneously in both tolerance zones.

Figure 107. UFBGA169 - Recommended footprint

Dsm

Dpad

STM32H7B3xI

UFBGA169 package information

DS13139 - Rev 8

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