STM32H7B3AI datasheet(226/238 Pages) STMICROELECTRONICS

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Date

Revision

Changes

Extended Figure 55. ADC accuracy characteristics to both ADC resolutions and

updated Figure 56. Typical connection diagram using the ADC with FT/TT pins

featuring analog switch function.

Replace 110 °C by 130 °C in Table 100. Analog temperature sensor calibration

values.

Updated tsu(ADV-CLKH), th(CLKH-ADV), tsu(NWAIT-CLKH) and th(CLKH-NWAIT) minimum

values in Table 9. Updated tsu(DV-CLKH), th(CLKH-DV), t(NWAIT-CLKH) and th(CLKH-

NWAIT) minimum values in Table 82. Synchronous non-multiplexed NOR/PSRAM

read timings. Updated tsu(SDCLKH _Data) and th(SDCLKH _Data) minimum values in

Table 86. SDRAM read timings. Updated tsu(SDCLKH_Data) and th(SDCLKH_Data)

minimum values in Table 87. LPSDR SDRAM read timings.

Section 6.3.19 Octo-SPI interface characteristics:

•

Updated tS(IN)//tH(IN) conditions and minimum values in Table 90. OCTOSPI

characteristics in SDR mode. Updated Figure 49. OctoSPI timing diagram -

SDR mode.

•

Updated Table 91. OCTOSPI characteristics in DTR mode (with DQS)/Octal

and Hyperbus and Figure 50. OctoSPI timing diagram - DTR mode.

•

Updated Figure 51. OctoSPI Hyperbus clock, Figure 52. OctoSPI Hyperbus

read and Figure 53. OctoSPI Hyperbus write.

Table 118. SPI dynamic characteristics:

•

Changed tsu(MI) and th(MI) minimum values in Master mode.

•

Removed tw(SCKH), tw(SCKL).

Table 122. Dynamics characteristics: SDMMC characteristics, VDD=2.7 to 3.6 V:

•

Modified tISU and tIH minimum values for CMD/ D inputs in High-speed

mode.

•

Modified tISUD and tIH minimum values for CMD/ D inputs in Default mode.

Table 123. Dynamics characteristics: eMMC characteristics VDD=1.71V to 1.9V:

•

Removed SDIO_CK/fPCLK2 frequency ratio.

•

Modified tISU and tIH minimum values in CMD, D inputs (referenced to CK)

in eMMC mode.

Section 7.7 TFBGA216 package information:

•

Added note 2 below Figure 100. TFBGA216 - Outline.

•

Changed A maximum value from 1.100 to 1.200 and added note 2,3 4 and

5 in table 1.Table 136. TFBGA216 - Mechanical data.

•

Updated Figure 101. TFBGA216 - Recommended footprint and

Table 137. TFBGA216 - Recommended PCB design rules (0.8 mm pitch) .

Section 7.9 UFBGA169 package information:

•

Added note 2 below Figure 106. UFBGA169 - Outline.

•

Updated Table 140. UFBGA169 - Mechanical data.

•

Removed note related to non-solder mask below Figure 107. UFBGA169 -

Recommended footprint.

Section 7.10 UFBGA(176+25) package information:

•

Added note 2 below .

•

Updated .

18-May-2022

Renamed SPIx_NSS signal into SPIx_SS.

Updated Table 20. Current characteristics.

Removed fTraceCK / fJTCK from Table 23. Maximum allowed clock frequencies.

Updated note 3 in Table 40. Typical current consumption in System Stop mode.

Updated Table 61. EMI characteristics for fHSE = 8 MHz and fHCLK = 64 MHz.

Updated Table 66. Output voltage characteristics for all I/Os except PC13, PC14,

PC15 and PI8 and Table 67. Output voltage characteristics for PC13, PC14,

PC15 and PI8. Added Table 70. Pxy_C and Pxy analog switch characteristics.

STM32H7B3xI

DS13139 - Rev 8

page 226/238

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