STM32H7B3AI datasheet(231/238 Pages) STMICROELECTRONICS

231 / 238 page

6.3.28

Comparator characteristics ............................................... 157

6.3.29

Operational amplifier characteristics ........................................ 158

6.3.30

Digital filter for Sigma-Delta Modulators (DFSDM) characteristics.................. 160

6.3.31

Camera interface (DCMI) timing specifications ................................ 162

6.3.32

PSSI interface characteristics ............................................. 163

6.3.33

LCD-TFT controller (LTDC) characteristics ................................... 166

6.3.34

Timer characteristics .................................................... 167

6.3.35

Low-power timer characteristics ........................................... 168

6.3.36

Communication interfaces................................................ 168

Package information............................................................ 184

7.1

LQFP64 package information ..................................................185

7.1.1

Device marking for LQFP64 .............................................. 187

7.2

LQFP100 package information .................................................189

7.2.1

Device marking for LQFP100 ............................................. 192

7.3

TFBGA100 package information ................................................193

7.3.1

Device marking for TFBGA100 ............................................ 196

7.4

WLCSP132 package information ...............................................197

7.4.1

Device marking for WLCSP132............................................ 199

7.5

LQFP144 package information .................................................200

7.5.1

Device marking for LQFP144 ............................................. 203

7.6

LQFP176 package information .................................................204

7.6.1

Device marking for LQFP176 ............................................. 206

7.7

TFBGA216 package information ................................................208

7.7.1

Device marking for TFBGA216 ............................................ 210

7.8

TFBGA225 package information ................................................ 211

7.8.1

Device marking for TFBGA225 ............................................ 213

7.9

UFBGA169 package information................................................214

7.9.1

Device marking for UFBGA169 ............................................ 216

7.10

UFBGA(176+25) package information ...........................................217

7.10.1

Device marking for UFBGA176+25 ......................................... 219

7.11

Thermal characteristics .......................................................219

7.11.1

Reference documents ................................................... 221

Ordering information ........................................................... 222

Important security notice ............................................................ 223

Revision history ..................................................................... 224

List of tables ........................................................................ 232

List of figures........................................................................ 235

STM32H7B3xI

Contents

DS13139 - Rev 8

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