8 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed below.

8.1 Documentation Support

8.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, Isolation Glossary application report

• Texas Instruments, Semiconductor and IC Package Thermal Metrics application report

• Texas Instruments, ISO72x Digital Isolator Magnetic-Field Immunity application report

• Texas Instruments, ISO72x Digital Isolator Magnetic-Field Immunity application report

• Texas Instruments, Diagnosing Delta-Sigma Modulator Bitstream Using C2000™ Configurable Logic Block

(CLB) application report

• Texas Instruments, Combining the ADS1202 with an FPGA Digital Filter for Current Measurement in Motor

Control Applications application report

• Texas Instruments, Delta Sigma Modulator Filter Calculator design tool

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

9 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision * (August 2024) to Revision A (December 2024)

Page

• Updated the numbering format for tables, figures, and cross-refrerences throughout the document................ 1

• Changed the device status from Advanced to Production..................................................................................1

AMC0136

SBASAZ0A – AUGUST 2024 – REVISED DECEMBER 2024

www.ti.com

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